Laser Quenching equipment
Perform phase transformation hardening treatment on the metal surface to improve the hardness, wear ...
Perform phase transformation hardening treatment on the metal surface to improve the hardness, wear ...
Used for surface strengthening, repair, and remanufacturing of components, the coating has high adhe...
Flexible processing of complex curved sheet metal parts, with high cutting accuracy, fast speed, and...
Specially designed for seamless welding of precision plastic components, with a small heat affected ...
The precision of the cutting edge of the photovoltaic silicon wafer cutting wheel directly determines the quality of the silicon wafer. A wear of 0.01mm on the edge will lead to a sharp increase in the breakage rate of the silicon wafer. Traditional diamond cutting wheels are basically disposable consumables due to the lack of strengthening treatment on the edge. The annual procurement cost of a large photovoltaic enterprise in China exceeds 800000 yuan. Daokedao adopts ultra high speed laser cladding technology, which melts a 0.02mm thick silicon carbide coating on the edge of the diamond cutter wheel at a cladding speed of 15m/s. The bonding strength between the coating and the substrate reaches 600MPa, and the precision of the repaired blade edge reaches 0.003mm. After application, the cutter wheel can be reused 5 times, and the silicon wafer rupture rate is reduced from 3% to 0.8%, directly saving the annual purchase cost of the cutter wheel by 600000 yuan. Even more surprisingly, the improvement in blade smoothness increased cutting efficiency by 4%, and the output of silicon wafers increased synchronously. The production director of the factory commented that "this is a key technology for reducing costs and increasing efficiency in the photovoltaic cutting process".
