Laser Quenching equipment
Perform phase transformation hardening treatment on the metal surface to improve the hardness, wear ...
Perform phase transformation hardening treatment on the metal surface to improve the hardness, wear ...
Used for surface strengthening, repair, and remanufacturing of components, the coating has high adhe...
Flexible processing of complex curved sheet metal parts, with high cutting accuracy, fast speed, and...
Specially designed for seamless welding of precision plastic components, with a small heat affected ...
Electronic chip heat dissipation substrates need to have both high thermal conductivity and wear resistance. Traditional copper substrates are prone to oxidation on the surface, and the heat dissipation efficiency decreases over time. The Daokedao automated laser cladding equipment uses Cu Cr Zr copper based alloy powder to fuse a 1-2mm reinforced heat dissipation layer on the surface of the copper substrate. The thermal conductivity of the cladding layer reaches 350W/(m · K), which is 15% higher than that of traditional copper substrates. The surface has excellent oxidation resistance and a hardness of HRC25-30. After being applied in an electronic enterprise, the working temperature of the chip decreased by 10 ℃, and the service life of the heat dissipation substrate was extended to 5 years. The high-precision cladding technology of the equipment ensures that the substrate flatness error is ≤ 0.01mm, which is suitable for chip packaging requirements.
