Laser Quenching equipment
Perform phase transformation hardening treatment on the metal surface to improve the hardness, wear ...
Perform phase transformation hardening treatment on the metal surface to improve the hardness, wear ...
Used for surface strengthening, repair, and remanufacturing of components, the coating has high adhe...
Flexible processing of complex curved sheet metal parts, with high cutting accuracy, fast speed, and...
Specially designed for seamless welding of precision plastic components, with a small heat affected ...
The precision requirement for semiconductor silicon wafer cutting molds is ± 0.001mm, and traditional repairs cannot meet the high-precision requirements. After the mold wears out, the cutting size of the silicon wafer deviates, resulting in chip scrap and a mold scrap rate of over 60%.
The Daokedao laser cladding equipment adopts ultra micro beam laser and precision positioning technology, with a spot diameter of 0.02mm, to accurately clad the worn parts of the mold. Using ultrafine wear-resistant alloy powder, the thickness error of the cladding layer is ≤± 0.001mm, fully meeting the requirements of silicon wafer cutting accuracy.
The service life of the repaired mold has been extended by 2.5 times, the pass rate of silicon wafer cutting has increased by 20%, and the repair cost is only 1/6 of the new mold. After adopting this technology, a semiconductor enterprise reduced the cost of mold procurement by 80%, solving the technical bottleneck of precision cutting mold repair.
