Laser Quenching equipment
Perform phase transformation hardening treatment on the metal surface to improve the hardness, wear ...
Perform phase transformation hardening treatment on the metal surface to improve the hardness, wear ...
Used for surface strengthening, repair, and remanufacturing of components, the coating has high adhe...
Flexible processing of complex curved sheet metal parts, with high cutting accuracy, fast speed, and...
Specially designed for seamless welding of precision plastic components, with a small heat affected ...
The semiconductor wafer carrier is used to adsorb and fix wafers for photolithography processing, with a surface flatness requirement of ≤ 0.002mm. Traditional grinding and repair after wear can easily lead to surface scratches, resulting in a skyrocketing wafer scrap rate. Daokedao adopts nanoscale laser cladding technology to melt high-purity alumina ceramic coatings, with a coating purity of 99.99%. After repair, the surface flatness reaches 0.001mm and the surface roughness Ra0.02 μ m, fully meeting the requirements of semiconductor processing. After being applied by a semiconductor factory in Taiwan, China, the life of the carrier platform has been extended from one year to three years, the scratch rate of wafers caused by the carrier platform problems has decreased from 1.2% to 0.1%, and the repair cost of a single carrier platform is only 1/5 of that of a new one, saving more than $2 million in equipment procurement costs annually. This technology has been certified by SEMI international semiconductor standards and has become a qualified maintenance solution supplier for TSMC and UMC.
