Laser Quenching equipment
Perform phase transformation hardening treatment on the metal surface to improve the hardness, wear ...
Perform phase transformation hardening treatment on the metal surface to improve the hardness, wear ...
Used for surface strengthening, repair, and remanufacturing of components, the coating has high adhe...
Flexible processing of complex curved sheet metal parts, with high cutting accuracy, fast speed, and...
Specially designed for seamless welding of precision plastic components, with a small heat affected ...
The dimensional accuracy requirement for semiconductor packaging mold inserts is ± 0.002mm. Traditional grinding and repair methods can easily lead to insert size deviations, pin offset in packaging chips, and inability to repair small scratches. The mold scrap rate exceeds 50%, and the cost is high.
The Daokedao laser cladding equipment adopts ultrafine beam laser+CCD visual positioning technology, with a spot diameter of 0.03mm, to accurately fuse scratches and wear areas. Select ultra-fine alloy powder that matches the mold material, with a thickness error of ≤± 0.001mm for the cladding layer, fully meeting the precision requirements of semiconductor packaging.
The service life of the repaired inserts has been extended by 2.5 times, the chip packaging qualification rate has increased by 20%, and the repair cost is only 1/6 of the new inserts. After adopting this technology, a semiconductor enterprise reduced the cost of mold procurement by 80%, solving the technical bottleneck of precision packaging mold repair.
