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Laser Quenching equipment

Laser Quenching equipment

Perform phase transformation hardening treatment on the metal surface to improve the hardness, wear ...

Laser Cladding equipment

Laser Cladding equipment

Used for surface strengthening, repair, and remanufacturing of components, the coating has high adhe...

3D Laser Cutting equipment

3D Laser Cutting equipment

Flexible processing of complex curved sheet metal parts, with high cutting accuracy, fast speed, and...

Plastic Laser Welding equipment

Plastic Laser Welding equipment

Specially designed for seamless welding of precision plastic components, with a small heat affected ...

Semiconductor equipment repair accuracy: micrometer level control ensures chip processing quality
Date:2025-11-18 14:14     Source:daokedao     Browse:74

Precision components such as semiconductor wafer carriers and lithography equipment accessories may affect chip quality with a wear of only 0.01mm. The Daokedao laser cladding equipment is equipped with a real-time calibration system for laser interferometers, with a cladding spot positioning error of ≤ 0.005mm and a repaired component flatness error of<0.003mm/m. Special materials such as high-purity alumina ceramics and single crystal diamond are selected, with a coating purity of 99.99% and no risk of particle detachment, in compliance with SEMI F021 cleanroom standards. The equipment is equipped with an electrostatic elimination system, and the dust concentration in the working environment is controlled at Class 5, which can meet the precision repair needs of semiconductor packaging and testing equipment. The repair cost is only 30% -40% of that of new parts.

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