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Repair of Electronic Device Connector Mold: The Micro Precision Cladding Advantage of Daokedao Laser Cladding
Date:2025-11-06 14:09     Source:daokedao     Browse:29

The cavity size of electronic device connector molds is very small (minimum aperture ≤ 0.2mm), and traditional repairs are difficult to ensure the accuracy of the cavity contour, resulting in poor connector insertion and removal, dimensional deviation, and the mold is usually directly scrapped.

The Daokedao laser cladding equipment adopts fiber optic microbeam laser technology, with a spot diameter of 0.03mm, which can accurately fuse the small wear parts of the cavity. Obtaining raw cavity data through 3D scanning, the accuracy error of the cavity after melting is ≤± 0.002mm, perfectly restoring the forming accuracy of the connector.

The service life of the repaired mold has been doubled, the connector qualification rate has increased by 18%, and the repair cost is only 1/5 of the new mold. After adopting this technology, a certain electronic equipment factory reduced the scrap rate of molds by 80% and saved over 300000 yuan in annual procurement costs.


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