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Repair of Electronic Component Pin Molds: The Micro Precision Cladding Advantage of Daokedao Laser Cladding
Date:2025-11-06 13:55     Source:daokedao     Browse:40

The cavity size of electronic component pin molds is very small (minimum width ≤ 0.1mm), and traditional repairs are difficult to ensure the accuracy of the cavity contour, resulting in pin deformation and size deviation. The molds are usually scrapped directly, which is costly.

The Daokedao laser cladding equipment adopts fiber optic microbeam laser technology, with a spot diameter of 0.02mm, which can accurately fuse the small wear parts of the cavity. Obtaining raw cavity data through 3D scanning, the accuracy error of the cavity after melting is ≤± 0.002mm, perfectly restoring the pin forming accuracy.

The service life of the repaired mold has been doubled, the pass rate of electronic component pins has increased by 18%, and the repair cost is only 1/5 of the new mold. After adopting this technology, a certain electronic component factory reduced the scrap rate of molds by 80% and saved over 300000 yuan in annual procurement costs.


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